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All issuesVolume 306, Issue 1IT NewsTechnology

Samsung Teases 1TB DDR5 Modules With Launch Of 32Gb Die

The Register, Monday, September 4,2023

China allows first wave of chatbots, India's sun-spotter soars; ASUS smacks down speculation it will quit smartphones

Samsung last Friday announced it has developed a 32-gigabit DDR5 DRAM die using its 12 nanometer-class process technology.

The Korean giant has mass-produced 16Gb DRAM since May 2023, and claimed its new and denser product "paves way to DRAM modules of up to 1TB capacity" without offering any hint of a roadmap or timeframe for those colosso-modules to debut.

Nor has Samsung hinted at the price a 32Gb module will command.

But SangJoon Hwang, executive vice president of DRAM Product & Technology at Samsung Electronics, said 1TB modules will be welcomed by those running AI and big data applications.

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