Rapidus And IB Expand Collaboration To Chiplet Packaging Technology For 2nm-Generation Semiconductors
IBM News, Monday, June 3rd, 2024
Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology
Rapidus Corporation, a manufacturer of advanced logic semiconductors, and multinational technology company IBM (NYSE: IBM), announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors, and the two companies will collaborate with the aim to further innovate in this space.