Intel Flashes 4 Tbps Optical Chiplet To Supercharge Datacenters
The Register, Thursday, June 27th, 2024
Likens tech to going from horse-drawn carriages to trucks
Intel has demonstrated an optical chiplet co-packaged with a CPU capable of supporting 4 Tbps data links to feed the increasing datacenter bandwidth requirements of AI and high performance computing (HPC) applications.
The Santa Clara chipmaker claims its prototype optical compute interconnect (OCI) chiplet is a leap forward in high-bandwidth interconnect tech. The company has backed silicon photonics for many years.
Intel's demonstration at the Optical Fiber Communication Conference earlier this year showcased a data connection between two systems over a single-mode optical fiber patch cord. Both systems used an OCI chiplet co-packaged with an Intel CPU.