ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
IBM News, Tuesday, July 23rd, 2024
Latest agreement aims to advance thermocompression and hybrid bonding methods for chiplet packages
ASMPT and IBM (NYSE: IBM) announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies. Through the agreement, the two companies will work together to advance thermocompression and hybrid bonding technology for chiplet packages, using ASMPT's next generation of Firebird TCB and Lithobolt hybrid bonding tools.
Chiplets deconstruct SOCs into their composite parts, creating smaller chips that can then be packaged together to operate as a single system, to provide potential benefits that can include improved energy efficiency, faster system development cycle time, and reduced costs. However, packaging advances are needed to move chiplets from research to mass production more quickly and efficiently, driven by the rapid pace of innovation in AI computing.