Broadcom Delivers Industry's First 3.5D F2F Technology for AI XPUs
Broadcom News, Thursday, December 5th, 2024
Combination of 3D silicon stacking and 2.5D packaging technology enables custom compute platforms with breakthrough performance, power and cost
Broadcom announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP) platform technology, enabling consumer AI customers to develop next-generation custom accelerators (XPUs). The 3.5D XDSiP integrates more than 6000 mm2 of silicon and up to 12 high bandwidth memory (HBM) stacks in one packaged device to enable high-efficiency, low-power computing for AI at scale.
Broadcom has achieved a significant milestone by developing and launching the industry's first Face-to-Face (F2F) 3.5D XPU.