Broadcom Advances Optical Connectivity for AI Infrastructure with Industry-Leading Solutions at OFC 2025
Broadcom News, Monday, March 31st, 2025
Broadcom showcases optical interconnect solutions for next generation AI clusters; Highlights path to 200T
Broadcom announced the expansion of its portfolio of optical interconnect solutions to enable AI infrastructure. These innovative technologies, including advancements in co-packaged optics (CPO), 200G/lane DSP and SerDes, 400G optics, and PCIe Gen6 over optics, will be showcased at the 2025 Optical Fiber Communications Conference and Exhibition (OFC). Broadcom's demonstrations highlight the company's roadmap towards 200T optical interconnect solutions.