Lightmatter Aims To Leapfrog I/O Limitations With 3D Photonic Interconnect
HPCwire, Thursday, December 4th, 2025
The faster you can move data between processors, the more work you can theoretically get done. This is what's driving innovation in interconnects, for both scale-up as well as scale-out systems. One company that's looking to leapfrog the class is Lightmatter, which is developing a new three-dimensional co-packaged optic (CPO) interconnect that promises big increases in I/O.
Compute accelerators are critical for AI workloads, particularly for training large language models (LLMs) and other types of generative AI models. Nvidia leads the class with its powerful Blackwell GPU, but other chip makers like AMD, Broadcom, and Intel-not to mention cloud giants like Google, AWS, and Microsoft-are looking to innovate and claim a share of the booming market.