Supermicro Expands Liquid Cooling for NVIDIA Vera Rubin NVL72 and HGX Rubin NVL8 Platforms
StorageReview, Monday, January 5th, 2026
Supermicro announced expanded rack-scale manufacturing capacity and upgraded direct liquid cooling capabilities to support the upcoming NVIDIA Vera Rubin NVL72 and NVIDIA HGX Rubin NVL8 platforms.
The company is positioning the move to shorten deployment timelines for high-density AI infrastructure by combining US-based in-house design and manufacturing with its Data Center Building Block Solutions (DCBBS) approach and an end-to-end liquid-cooling technology stack.
Supermicro CEO Charles Liang emphasized that the company's collaboration with NVIDIA and its building-block design methodology are intended to accelerate the delivery of advanced AI platforms. He also highlighted Supermicro's expanded manufacturing footprint and liquid-cooling expertise as key enablers of efficient, reliable, large-scale deployments of Vera Rubin and Rubin systems across hyperscale and enterprise environments.