Cisco Targets High-Speed AI Networking With 102.4Tbps Chip, Liquid-Cooled Switches
Cisco, Tuesday, February 10th, 2026
Cisco Systems Inc.introduced a new generation of networking silicon, systems and optical modules aimed at supporting hyperscale-class artificial intelligence infrastructure as AI workloads shift from model training toward broader inference and agentic applications.
At Cisco Live EMEA in Amsterdam, the company unveiled its Silicon One G300, a 102.4-terabit-per-second Ethernet switching chip designed to support massive 'scale-out' AI clusters. Cisco said the chip will power new Nexus 9000 and Cisco 8000 switching platforms that can be deployed in high-density, air- and liquid-cooled configurations to reduce power consumption and simplify operations for organizations building large AI networks.